tech π‘ Hybrid bonding market set for major growth by 2032
The global Hybrid Bonding Equipment market is forecasted to grow significantly at a 24.7% CAGR through 2032. This growth is happening because of the rising adoption of 3D ICs across the semiconductor industry. The market was valued at US$201 million in 2025 and is projected to hit US$924 million by 2032. Hybrid bonding is key for connecting stacked dies with fine pitches, which boosts performance for AI and HPC. Manufacturers are investing heavily in this technology to meet advanced packaging demands.