π± China's CXMT to power Xiaomi's next foldable phone
China's memory chipmaker, CXMT, is set to supply LPDDR6 DRAM chips for Xiaomi's new flagship folding phone. This partnership involves CXMT, based in Hefei, and Xiaomi, a major global smartphone maker. The LPDDR6 chips will be used in the 18 Fold, which is scheduled for release in September. This advanced chip helps CXMT bridge the tech gap with Samsung and SK Hynix. The device is also expected to utilize Xiaomi's new Xring O3 3-nanometre processor.